Semiconductor package with structures for cooling fluid retention

ABSTRACT

A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds.

BACKGROUND OF THE INVENTION

The present invention relates generally to the fields of liquid coolingof semiconductor chip circuitry, including phenomena such asgas-assisted evaporation of the cooling fluid, wetting of the chipsurface(s) to be cooled and liquid retention by capillary force.

Gas-assisted direct liquid cooling (GADLC) integrated circuit devices(ICs) are known. GADLC ICs are shaped to define interior space havinginterior surfaces. At least one of the interior surfaces (hereinreferred to as the liquid/chip interface) at, or at least close to, theIC circuitry that, in operation, generates heat such that cooling isrequired, or at least helpful. The interior space may have, locatedwithin it, porous material, such as a porous membrane. Gas and coolantfluid are circulated through the interior space in order to remove heatfrom the vicinity of the heat-generating circuitry of the IC.

It is conventionally recognized that conventional GADLC ICs mayexperience “dry spots” at the liquid/chip interface. These dry spotshamper the cooling efficiency and reliability of the technology. Inorder to attempt to reduce dry spots, conventional GADLC IC include amembrane (as mentioned in the previous paragraph) and a support layer.The membrane and support layer are located in the interior space. Thismembrane and support layer are separate parts that are not integral orunitary with the material that forms the interior surfaces of theinterior space. The membrane is conventionally a micro-/nano-porousmembrane to maintain the coolant in the pores, and a porous supportlayer at the interface to keep the nano-membrane from coming in todirect contact with the chip.

SUMMARY

According to an aspect of the present invention, a semiconductorassembly includes: (i) a substrate member including a first chip and atop surface; and (ii) a cap member with a first recess located therein,the cap member including a first recess surface and a first set of rigidsmall scale structure(s) extending from at least a portion of the firstrecess surface into the first recess, with the first recess surface andthe first set of rigid small scale structures defining the first recess.The first set of rigid small scale structure(s) include at least one ofthe following: (a) a structure having formed therein pores, gaps and orinterstitial spaces less than 100 micrometers but more than 100nanometers, and (b) a structure having formed therein pores, gaps and orinterstitial spaces less than 100 nanometers. The first set of rigidsmall scale structure(s) are sized, shaped and located to provide forappropriate fluid flow when gas and liquid are circulated through thefirst recess for gas-assisted direct liquid cooling. The cap member isattached to the top surface of the substrate member at a location suchthat circulation of gas and liquid through the first recess will coolthe first chip by gas-assisted direct liquid cooling.

According to a further aspect of the present invention, a method ofmanufacturing a semiconductor assembly includes the following steps (notnecessarily in the following order): (i) shaping a cap member to includea first set of small-scale-structure(s) and a first recess surface, withthe first recess surface and first set of rigid small scale structure(s)defining a recess formed in the cap member; and (ii) bonding the capmember to a top surface of a first substrate which includes a first chipso that the first recess is located over at least a portion of the topsurface and at least a portion of the first chip. The first set ofsmall-scale-structure(s) are rigid. The cap member and first set ofsmall-scale-structure(s) are sized, shaped, located and/or bonded sothat: (i) the first set of small-scale-structure(s) face at least aportion of the top surface of the first chip, (ii) the first set ofsmall-scale-structure(s) spaced away from the top surface of the firstchip, and (iii) the first set of small scale structure(s) includes atleast one of the following: (a) a structure having formed therein pores,gaps and or interstitial spaces less than 100 micrometers but more than100 nanometers, and (b) a structure having formed therein pores, gapsand or interstitial spaces less than 100 nanometers.

According to a further aspect of the present invention, a semiconductorassembly includes: (i) a substrate member including a plurality of chipsand a top surface; and (ii) a cap member with a plurality of recessesformed therein, the cap member including a recess surface correspondingto each recess of the plurality of recesses and a plurality of sets ofrigid small scale structure(s) respectively extending from at least aportion of each recess surface into each recess, with each recesssurface and each set of rigid small scale structure(s) respectivelydefining a corresponding recess of the plurality of recesses. Each setof rigid small scale structure(s) includes a structure having formedtherein pores, gaps and or interstitial spaces equal to or less than 100micrometers. Each set of rigid small scale structure(s) are sized,shaped and located to provide for appropriate fluid flow when gas andliquid are circulated through the first recess for gas-assisted directliquid cooling. The cap member is attached to the top surface of thesubstrate member at a location such that circulation of gas and liquidthrough each recess cools a corresponding chip of the plurality of chipsby gas-assisted direct liquid cooling.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIGS. 1 to 7A are cross-sectional views of a semiconductor assemblycorresponding respectively to seven stages of a first semiconductorfabrication method;

FIG. 7B is a plan view of the seventh stage of the first embodimentfabrication method;

FIGS. 8A, 8B, 8C and 8D are cross-sectional, detail views of a nanowireformation process suitable for use in some embodiments of the presentinvention;

FIGS. 9A, 9B, 9C, 9D, 9E, 9F, 9G and 9H are cross-sectional views of asemiconductor assembly corresponding respectively to eight stages of asecond semiconductor fabrication method;

FIGS. 10A, 10B, 10C, 10D and 10E are cross-sectional views of asemiconductor assembly corresponding respectively to five stages of athird semiconductor fabrication method;

FIGS. 11A, 11B, 11C, 11D, 11E, 11F, and 11G are cross-sectional views ofa semiconductor assembly corresponding respectively to four stages of asecond semiconductor fabrication method; and

FIGS. 12A, 12B, 12C, 12D and 12E are cross-sectional views of asemiconductor assembly corresponding respectively to five stages of asecond semiconductor fabrication method.

DETAILED DESCRIPTION

A preliminary note on terminology will now be made. In this document,empty spaces, such as voids, apertures holes and/or recesses are said tobe “defined” by the surfaces that surround the empty space. For example,the empty space inside of a cup is defined by the inner surface(s) ofthe cup itself.

Some embodiments of the present disclosure recognize one, or more, ofthe following: (i) because of the membrane structure required forconventional GADLC chips conventional processes are not easily and/orfeasibly scalable; and/or (ii) with conventional GADLC processing,precise control (such as, placement of the membrane and its support, theforce, the gap between the membrane and the chip surface, MNS structurecontrol) is difficult.

Some embodiments of the present invention are directed to fabricationmethods for making “built-in” MNSs for GADLC, such that there is noseparate membrane piece, but, rather, the MNS is part of a unitary andintegral cap piece that is fixed over a top surface of the semiconductorchip. Gas and/or liquid is circulated through an open space between thecap and a portion of the top surface of the semiconductor chip. The MNSsare located to extend from the main body of the cap, down into the openspace between the cap and chip, where they can appropriately assist withfluid circulation (for example, GADLC fluid circulation) for chipcooling. Two basic variations of the various embodiments of the presentinvention are as follows: (i) providing the cap structure on a chip bychip basis; and (ii) providing the cap structure on a wafer by waferbasis. Some embodiments of the present invention are believed to be moreamenable to wafer by wafer fabrication than is the conventionalnano-membrane technology. Accordingly, while the embodiments to bedescribed below will show only a single chip, some embodiments of thepreferred invention will provide a single cap piece with multiple,discrete fluid spaces for multiple chip areas that reside on a singlewafer.

As shown in FIGS. 1 to 7 b, a first fabrication method includes six (6)intermediate assemblies 100 a, 100 b, 100 c, 100 d, 100 e and 100 f andone final assembly 100 g (which is also shown in plan view in FIG. 7b ).For pedagogical purposes, it is noted that the respective assemblies 100a to 100 g do not represent an exhaustive list of assembly states duringmanufacture, but, rather, these assemblies were chosen to efficientlyassist those of skill in the art to understand the devices and/ormanufacturing processes of the present invention. The followingparagraphs will describe the processes involved in transforming thestarting assembly 100 a to intermediate assembly 100 b, intermediateassembly 100 b to intermediate assembly 100 c, intermediate assembly 100c to intermediate assembly 100 d, and so on until the final assembly of100 g is attained for use as an embodiment of a GADLC IC device. Asshown in FIG. 1, in intermediate sub-assembly 100 a, a chip sized area(shown) of a larger piece (not shown) of silicon cap material 102 (forexample, silicon) is partially overlaid with a bonding layer 104. Morespecifically, the bonding layer is shaped to have a square hole 106 atits central region.

As manufacturing processes according to this embodiment of the presentinvention transform intermediate assembly 100 a of FIG. 1 tointermediate assembly 100 b of FIG. 2, the portion of the top surface ofcap 102 exposed by hole 106 of boding layer 104 has material removed ina top down fashion in order to form recess 112. The recess may beformed, for example by conventional wet etching or conventional dryetching.

As manufacturing processes according to this embodiment of the presentinvention transform intermediate assembly 100 b of FIG. 2 tointermediate assembly 100 c of FIG. 3, MNSs 114 are formed at the bottomof the recess in cap 102 as shown in FIG. 3. This process for formingMNSs is shown in more detail in FIGS. 8A to 8D, where: (i) in FIG. 8A, aphotoresist layer 150 is applied over semiconductor cap 102; (ii) inFIG. 8B, radiation R is selectively transmitted by mask 152 so that thephotoresist layer can be selectively removed, at a nano- or micro-scale;(iii) In FIG. 8C, the semiconductor cap is etched in a top down materialremoval fashion, except in portions underlying remaining portions of thephotoresist layer; and (iv) in FIG. 8D, where the remaining portions ofthe photoresist layer are removed to expose the MNS protrusions left bythe selective etching. Alternatively, a bottom up process can be used tobuild MNSs, where certain areas of the upper surface of the silicon capare seeded with polymer and/or seed crystals so that silicon MNSprotrusions can be selectively built up from the seeded areas only. Forexample, conventional chemical vapor deposition can be used to build upthe silicon in the seeded areas to build bottom up MNS protrusions. Itis noted that the MNSs are built into a rigid cap here, rather thanbeing present in a conventional membrane structure.

As manufacturing processes according to this embodiment of the presentinvention transform intermediate assembly 100 c of FIG. 3 tointermediate assembly 100 d of FIG. 4, the cap is rotated (or, insemiconductor device fabrication parlance, “flipped”) and placed oversemiconductor substrate 120. Again, while FIGS. 1 to 7 a and 7 b showonly an area corresponding to a single chip, some devices according tothe present invention are fabricated at the wafer scale so that both thecap portion and the semiconductor substrate portion are wafer sized andinclude many chips, which will usually be cut apart to form multiplediscrete chips or chip stacks. In order to proceed from intermediateassembly 100 d of FIG. 4 to intermediate assembly 100 e of FIG. 5, thecap and substrate are moved relative to each other in the verticaldirection so that bonding layer 104 bonds the cap and substrate to eachother, aligned so that recess 106, 112 is located over the centralregion of the semiconductor substrate. The bonding layer can be oxide,metal-metal, adhesive, etc. In some embodiments, the bonding isasymmetric bonding, but symmetric bonding can also be applied, meaning asame bonding layer (with/without the same opening/recess) can also bepre-formed on the surface of substrate 120.

As manufacturing processes according to this embodiment of the presentinvention transform intermediate assembly 100 e of FIG. 5 tointermediate assembly 100 f of FIG. 6: (i) lithographic masking layer130 with 5 through holes is applied over the top surface of cap 102; and(ii) cap material 102, underlying the through holes in the masking, isremoved to form five (5) channels 140, 142, 144, 146, and 148. In someembodiments, the material removal performed to remove the channels isperformed by reactive ion etching (“silicon RIE”) as will be understoodby those of skill in the art. It is noted that there is some concernthat this material removal process could cause pieces of silicon to endup in open volume 106, 112, and impede performance of the completeproduct when the chip is put into use and has gas and liquid runningthrough it. In embodiments where this is a valid concern, thealternative fabrication methods, to be described below, will preventthis problem.

As manufacturing processes according to this embodiment of the presentinvention transform intermediate assembly 100 f of FIG. 6 to final chipassembly 100 g of FIGS. 7a and 7b the lithographic masking layer isremoved to yield the finished product. In wafer level fabricationprocesses, this is where the cutting of the wafer down to individual,capped chip assemblies can be done. The locations of the five (5)channels 140, 142, 144, 146 and 148 can be best understood by looking atboth FIGS. 7a and 7b in tandem. In this embodiment, when the chipassembly is operatively connected to a larger GADLC system: (i) channel140 acts as an inlet for liquid coolant into the interior space; (ii)channels 142 and 146 act as gas outlets for the GADLC gas; (iii) channel144 acts as a gas inlet for the GADLC gas; and (iv) channel 148 acts asa fluid inlet/outlet for the GADLC fluid. Alternatively, other channelgeometries are possible.

Before moving to other, alternative fabrication processes according tothe present invention, some possible variations on device 100 of FIGS. 1to 7 a and 7 b will now be set forth: (i) the footprint shape of theinterior space does not need to be square (for example, it could berectangular or circular); and/or (ii) the number of through holes formedat intermediate assembly 100 f of FIG. 6 may be different than 5 (thenumber is a matter of design choice that depends, at least in part, onthe gas flow and/or liquid flow requirements of a given GADLC ICdesign). The foregoing is by no means an exhaustive list of possiblevariations of the embodiment of device 100.

Before moving to other, alternative fabrication processes according tothe present invention, it is noted that some embodiments of the presentinvention may include one, or more, of the following features,characteristics and/or advantages: (i) the built-inmicro-/nano-structures do not require externally introducedmembranes/support materials; (ii) during fabrication, piece parts areeasier to handle and can be precisely controlled, fabricated and/orassembled by tailoring the MNSs, recession process, and bonding process;(iii) cooling structures can be fabricated in large scale semiconductorfabrication and packaging line with current process equipment andadvanced printing; (iv) profiling of the cap at the micro and/or nanoscale enables complex cooling structures and channels for optimalspecific local cooling; (v) the MNSs are spaced apart from the majorsurface of the chip which they face; (vi) a built-in structure forgas-assisted direct liquid cooling in advanced thermal management; (vii)a method of fabricating the structure for gas-assisted direct liquidcooling, the method being scalable to wafer-level 3D integration andpackaging; (viii) MNSs (such as MNS 114) in the form of a regular arrayof nanowires; (ix) nano-openings in the nano-structure layer that areinterconnected in the x-y plane, and therefore, as a whole, only needone gas inlet and one gas outlet for the circulation purposes; (x) havea nanowire (and/or pore) layer (for example MNS 114) that acts similarto the membrane layer of a conventional GADLC chip, with the functionsof (a) maintaining the liquid to prevent formation of dry spots, and (b)circulation in/out through gas in/out channels to improve the coolingefficiency (compared with only liquid coolant cooling); and (xi) the MNSstructure may be, or include well and/or via, such as nanowells ornanovias (nanowire arrays are interconnected in the X-Y direction, but ananowell/via array is isolated in X-Y direction so that, during cooling,the gas and/or liquid are contained in the well/via by capillary forceand pressure control). Some embodiments of the present invention mayinclude one, or more, of the following features, characteristics and/oradvantages: (i) a bonding layer and a recess region constructed as a“built in” structure in a rigid cap piece that maintains an accurateseparation gap between the MNSs and the upper surface of thesemiconductor chip; and/or (ii) easy to control (or “tune”) the size ofthe gap, between the MNS layer and the upper surface of thesemiconductor chip, in the range of a few microns to tens of microns.

FIGS. 9A to 9H respectively show seven (7) intermediate assemblies(assemblies 200 a, 200 b, 200 c, 200 d, 200 e, 200 f, 200 g of,respectively FIGS. 9A to 9G) and one (1) final assembly (assembly 200 hof FIG. 9H). These assemblies show a second example of a fabricationprocess according to the present disclosure called the “channel last,”MNSs first method. For pedagogical purposes, it is noted that therespective assemblies 200 a to 200 g do not necessarily represent anexhaustive list of assembly states during manufacture, but, rather,these assemblies were chosen to efficiently assist those of skill in theart to understand the devices and/or manufacturing processes of thepresent invention. The following paragraphs will describe the processesinvolved in transforming the starting assembly 200 a to intermediateassembly 200 b, intermediate assembly 200 b to intermediate assembly 200c, intermediate assembly 200 c to intermediate assembly 200 d, and so onuntil the final assembly of 200 g is attained for use as an embodimentof a GADLC IC device.

As shown in FIGS. 9A to 9H, the assemblies 200 a to 200 h collectivelyinclude: silicon cap layer (or, simply, “cap”) 202; bonding layer 204;rectangular hole 205; first photoresist layer 206; second photoresistlayer 208; MNS masking region 213; MNS region (or nanowires/nanowells)214; recesses 216; and channels 217.

As shown in FIG. 9A, first intermediate assembly 200 a is provided withbonding layer 204 overlaid on cap 202. As in the previous fabricationembodiment, the bonding layer has a rectangular hole 205.

As manufacturing processes according to this embodiment of the presentinvention transform first intermediate assembly 200 a (see FIG. 9A) tosecond intermediate assembly 200 b (FIG. 9B): (i) photoresist layer 206is overlaid over cap 202 and bonding layer 204 (for example, by spincoating); and (ii) photoresist layer 206 is patterned (for example, bylitho-patterning) to include MNS masking region 213. In order to proceedfrom second intermediate assembly 200 b (see FIG. 9B) to thirdintermediate assembly 200 c (FIG. 9C): (i) RIE is used to removematerial from the non-masked portions in the central region of cap 202in order to form MNS region (for example, nanowires) 214 of cap 202; and(ii) photoresist layer 206 is stripped away. Shape, diameter, and/ordepth of the MNSs of MNS region 214 can be customized easily. Typically,characteristic length in the radial direction is tens of nanometers to afew microns. Depth lies between a couple of hundred nanometers to tensof microns. Cross-sectional shape of the MNSs can be annular,rectangular, etc.

As manufacturing processes according to this embodiment of the presentinvention transform third intermediate assembly 200 c (see FIG. 9C) tofourth intermediate assembly 200 d (FIG. 9D): (i) a second photoresistlayer 208 is laid on top of assembly 200 c; and (ii) photoresist layer208 is patterned to have five (5) circular holes (in variousembodiments, this number of holes and resultant channels may be greateror smaller).

As manufacturing processes according to this embodiment of the presentinvention transform fourth intermediate assembly 200 d (see FIG. 9D) tofifth intermediate assembly 200 e (FIG. 9E): (i) RIE is used to removematerial from the non-masked portion MNS region 214 of cap 202 in orderto remove the nanowires (or other MNS structures) of MNS region 214 inthe shape of five (5) cylindrical recesses (also called “open areas”)216; and (ii) second photoresist layer 208 is stripped away. Diameter(s)of the open areas in this example are on the order of tens of microns toseveral millimeters.

As manufacturing processes according to this embodiment of the presentinvention transform fifth intermediate assembly 200 e (see FIG. 9E) tosixth intermediate assembly 200 f (FIG. 9F): (i) cap sub-assembly 202,204 is flipped into position in horizontal plane alignment with chip220; and (ii) the cap sub-assembly and the chip are moved into mutualcontact so that bonding layer 204 bonds the cap sub-assembly to the chipto form intermediate assembly 200 f. It is noted that a bonding layercan also be applied on the surface of the 220 substrate, with/without anopening/recess corresponding to 205 in the cap. As with the previousexample fabrication process, discussed above, the second examplefabrication process, now under discussion, can be performed at the wafer(with multiple chips) level, rather than at the single chip level, forexample in a three dimensional integration (3Di) or packaging scenario.

As manufacturing processes according to this embodiment of the presentinvention transform sixth intermediate assembly 200 f (see FIG. 9F) toseventh intermediate assembly 200 g (FIG. 9G) silicon cap layer 202 issubject to material removal to reduce its thickness. Wafer thinning canbe done by grinding, wet etch, RIE, or a combination of the foregoing.The final thickness of the top wafer is on the order of tens of micronsto a couple of hundreds of microns. Caps, according to variousembodiments of the present invention, can be full thickness orintentionally thinned. The thinning process can be done by grinding, wetetching, or dry etching, or combined, and can be carried out before orafter the bonding process. Also, a pre-thinned cap can be used, meaningthe cap can also be thinned first and then patterned through theprocesses of intermediate assemblies 200 a-200 e.

As manufacturing processes according to this embodiment of the presentinvention transform seventh intermediate assembly 200 g (see FIG. 9G) tofinal assembly 200 h (FIG. 9H) five (5) channels 217 are opened byremoving material from silicon cap layer 202. As shown in FIG. 9H, thesefive (5) channels are respectively aligned with the five (5) cylindricalrecesses 216 so that GADLC gases and/or liquids can be communicatedbetween the interior space of assembly 200 h and the outside. In thisexample, open areas 216 have somewhat larger diameters than theirrespective channels 217. This final interfacial structure between thetwo wafers and its enabled cooling function are different thanconventional GADLC cooled chip structures. The surface of the devicechip is usually capped (e.g., with NBLOK (that is dielectric capmaterial with a general formula of SiNxCyHz)). The silicon RIE processis selective to the capping material.

FIGS. 10A to 10E respectively show four (4) intermediate assemblies(assemblies 300 a, 300 b, 300 c, 300 d respectively FIGS. 10A to 10D)and one (1) sub-assembly (assembly 300 e of FIG. 10E). These assembliesshow a third example of a fabrication process according to the presentdisclosure called the “channel last open areas first method.”). Forpedagogical purposes, it is noted that the respective assemblies 300 ato 300 d do not represent an exhaustive list of assembly states duringmanufacture, but, rather, these assemblies were chosen to efficientlyassist those of skill in the art to understand the devices and/ormanufacturing processes of the present invention. The followingparagraphs will describe the processes involved in transforming thestarting assembly 300 a to intermediate assembly 300 b, intermediateassembly 300 b to intermediate assembly 300 c, and so on until the finalassembly of 300 e is attained for use as an embodiment of a GADLC ICdevice.

As shown in FIGS. 10A to 10E, assemblies 300 a to 300 e collectivelyinclude: silicon cap layer (or, simply, “cap”) 302; bonding layer 304;rectangular hole 305; first photoresist layer 306; second photoresistlayer 308; MNS masking region 313; MNS region (or nanowires) 314;masking open areas 315; and recesses 316.

As shown in FIG. 10A, first intermediate assembly 300 a is provided withthe bonding layer overlaid on cap 302. As in the previous fabricationembodiments, the bonding layer has a rectangular hole 305.

As manufacturing processes according to this embodiment of the presentinvention transform first intermediate assembly 300 a (see FIG. 10A) tosecond intermediate assembly 300 b (FIG. 10B): (i) first photoresistlayer 306 is overlaid over cap 302 and bonding layer 304; and (ii)photoresist layer 306 is patterned to include masking open areas 315.

As manufacturing processes according to this embodiment of the presentinvention transform second intermediate assembly 300 b (see FIG. 10B) tothird intermediate assembly 300 c (FIG. 10C): (i) RIE is used to removeportions of cap material underlying masking open areas 315 in order toform cylindrical recesses 316; and (ii) first photoresist layer 306 isstripped away.

As manufacturing processes according to this embodiment of the presentinvention transform third intermediate assembly 300 c (see FIG. 10C) tofourth intermediate assembly 300 d (FIG. 10D): (i) second photoresistlayer 308 is laid over assembly 300 c; and (ii) the second photoresistlayer is patterned to make MNS masking region 313.

As manufacturing processes according to this embodiment of the presentinvention transform fourth intermediate assembly 300 d (see FIG. 10D) tofinal assembly 300 e (FIG. 10E): (i) RIE is used to form MNSs (forexample, nanowires) in MNS region 314; and (ii) second photoresist layer308 is stripped away. In this third example fabrication process, furtherprocessing is similar to what is shown and discussed, above, inconnection with FIGS. 9F to 9H of the second example fabricationprocess.

FIGS. 11A to 11G respectively show six (6) intermediate assemblies(assemblies 400 a, 400 b, 400 c, 400 d, 400 e and 400 f respectivelyFIGS. 11A to 11F) and one (1) sub-assembly (assembly 400 g of FIG. 11G).These assemblies show a fourth example of a fabrication processaccording to the present disclosure called the “channel first, MNSs lastmethod.”). For pedagogical purposes, it is noted that the respectiveassemblies 400 a to 400 f do not represent an exhaustive list ofassembly states during manufacture, but, rather, these assemblies werechosen to efficiently assist those of skill in the art to understand thedevices and/or manufacturing processes of the present invention. Thefollowing paragraphs will describe the processes involved intransforming the starting assembly 400 a to intermediate assembly 400 b,intermediate assembly 400 b to intermediate assembly 400 c, intermediateassembly 400 c to intermediate assembly 400 d, and so on until the finalassembly of 400 f is attained for use as an embodiment of a GADLC ICdevice.

As shown in FIGS. 11A to 11G, assemblies 400 a to 400 g collectivelyinclude: silicon cap layer (or, simply, “cap”) 402; bonding layer 404;rectangular hole 405; first photoresist layer 406; second photoresistlayer 408; channel masking region 413; channels 414; MNS masking region415; and MNS region 416.

As shown in FIG. 11A, first intermediate assembly 400 a is provided withbonding layer 404 overlaid on cap 402. As in the previous fabricationembodiments, the bonding layer has a rectangular hole 405.

As manufacturing processes according to this embodiment of the presentinvention transform first intermediate assembly 400 a (see FIG. 11A) tosecond intermediate assembly 400 b (FIG. 11B): (i) first photoresistlayer 406 is overlaid over cap 402 and bonding layer 404; and (ii) firstphotoresist layer 406 is patterned to include channel masking region413.

As manufacturing processes according to this embodiment of the presentinvention transform second intermediate assembly 400 b (see FIG. 11B) tothird intermediate assembly 400 c (FIG. 11C): (i) RIE is used to removeportions of cap material underlying unmasked portions of channel maskingregion 413 in order to form channels 414; and (ii) first photoresistlayer 406 is stripped away. In this step, channel diameter is on theorder of tens of microns to a few millimeters, and depth is on the orderof tens to hundreds of microns. The opening of the channel structure canbe performed by RIE.

As manufacturing processes according to this embodiment of the presentinvention transform third intermediate assembly 400 c (see FIG. 11C) tofourth intermediate assembly 400 d (FIG. 11D): (i) second photoresistlayer 408 is laid over assembly 400 c; and (ii) the second photoresistlayer is patterned to make MNS masking region 415.

As manufacturing processes according to this embodiment of the presentinvention transform fourth intermediate assembly 400 d (see FIG. 11D) tofifth intermediate assembly 400 e (FIG. 11E): (i) RIE is used to formMNSs (for example, nanowires) in MNS region 416; and (ii) secondphotoresist layer 408 is stripped away.

As shown in FIGS. 11F to 11G, cap sub-assembly 402, 404 is flipped ontochip 420 (or larger chip bearing wafer (not shown)), bonded to it by thebonding layer and then subject to material removal from the cap so thatchannels 414 extend from the interior open space to the exterior surfaceof cap 402.

FIGS. 12A to 12E respectively show four (4) intermediate assemblies(assemblies 500 a, 500 b, 500 c and 500 d respectively of FIGS. 12A to12D) and one (1) final sub-assembly (assembly 500 e of FIG. 12E). Theseassemblies show a fifth example of a fabrication process according tothe present disclosure called the “MNSs first method, channels last(without open areas) method.”). For pedagogical purposes, it is notedthat the respective assemblies 500 a to 500 d do not necessarilyrepresent an exhaustive list of assembly states during manufacture, but,rather, these assemblies were chosen to efficiently assist those ofskill in the art to understand the devices and/or manufacturingprocesses of the present invention. The following paragraphs willdescribe the processes involved in transforming the starting assembly500 a to intermediate assembly 500 b, intermediate assembly 500 b tointermediate assembly 500 c, and so on until the final assembly of 500 dis attained for use as an embodiment of a GADLC IC device.

As shown in FIGS. 12A to 12E, assemblies 400 a to 400 g collectivelyinclude: cap 502; bonding layer 504; rectangular hole 505; firstphotoresist layer 506; second photoresist layer 508; MNS masking region513; MNS region 514; channel masking region 515; and channels 516.

As shown in FIG. 12A, first intermediate assembly 500 a is provided withbonding layer 504 overlaid on cap 502. As in the previous fabricationembodiments, the bonding layer has a rectangular hole 505.

As manufacturing processes according to this embodiment of the presentinvention transform first intermediate assembly 500 a (see FIG. 12A) tosecond intermediate assembly 500 b (FIG. 12B): (i) first photoresistlayer 506 is overlaid over cap 502 and bonding layer 504; and (ii) firstphotoresist layer 506 is patterned to include MNS masking region 513.

As manufacturing processes according to this embodiment of the presentinvention transform second intermediate assembly 500 b (see FIG. 12B) tothird intermediate assembly 500 c (FIG. 12C): (i) RIE is used to removeportions of cap material underlying unmasked portions of MNS maskingregion 513 in order to form MNS region 514; and (ii) first photoresistlayer 506 is stripped away.

As manufacturing processes according to this embodiment of the presentinvention transform third intermediate assembly 500 c (see FIG. 12C) tofourth intermediate assembly 500 d (FIG. 12D): (i) second photoresistlayer 508 is laid over assembly 500 c; and (ii) the second photoresistlayer is patterned to make channel masking region 515.

As manufacturing processes according to this embodiment of the presentinvention transform fourth intermediate assembly 500 d (see FIG. 12D) tofifth intermediate assembly 500 e (FIG. 12E): (i) RIE is used to formchannels 516; and (ii) second photoresist layer 508 is stripped away.Subsequent processing (not shown in the Figures) is similar to thatdiscussed above in connection with FIGS. 11F and 11G of the fourthexample fabrication process.

The following paragraphs set forth some definitions.

Present invention: should not be taken as an absolute indication thatthe subject matter described by the term “present invention” is coveredby either the claims as they are filed, or by the claims that mayeventually issue after patent prosecution; while the term “presentinvention” is used to help the reader to get a general feel for whichdisclosures herein that are believed as maybe being new, thisunderstanding, as indicated by use of the term “present invention,” istentative and provisional and subject to change over the course ofpatent prosecution as relevant information is developed and as theclaims are potentially amended.

Embodiment: see definition of “present invention” above—similar cautionsapply to the term “embodiment.”

and/or: inclusive or; for example, A, B “and/or” C means that at leastone of A or B or C is true and applicable.

Micro-structure: a structure having formed therein pores, gaps and orinterstitial spaces equal to or less than 100 micrometers but more than100 nanometers; for example, a set of microwires arranged in a regulararray and spaced at a center-to-center pitch of 100 micrometers would bean example (although not necessarily a preferred example) of a“micro-structure.”

Nano-structure: a structure having formed therein pores, gaps and orinterstitial spaces equal to or less than 100 nanometers; for example, aset of nanowires arranged in a regular array and spaced at acenter-to-center pitch of 100 nanometers would be an example (althoughnot necessarily a preferred example) of a “nano-structure.”

Small-scale-structure: a micro-structure or nano-structure.

Rigid: at least substantially as rigid as the least rigid of thefollowing: silicon, SixAly, SiC, SixNy, quartz, AN, or Al₂O₃; more rigidthan a polymer membrane.

Surface: not limited to planar, continuous and/or smooth surfaces.

What is claimed is:
 1. A semiconductor assembly including: a substratemember including a first chip and a top surface; and a cap member with afirst recess formed therein, the cap member including a first recesssurface and a first set of rigid small scale structure(s) extending fromat least a portion of the first recess surface into the first recess,with the first recess surface and the first set of rigid small scalestructure(s) defining the first recess; wherein: the first set of rigidsmall scale structure(s) include a structure having formed thereinpores, gaps and or interstitial spaces sized and shaped to facilitategas-assisted direct liquid cooling fluid flow through the first recess;the first set of rigid small scale structure(s) are sized, shaped andlocated to provide for appropriate fluid flow when gas and liquid arecirculated through the first recess for gas-assisted direct liquidcooling; the cap member is attached to the top surface of the substratemember at a location such that circulation of gas and liquid through thefirst recess cools the first chip by gas-assisted direct liquid cooling;the member cap has a plurality of channels formed therethrough, with thechannels being shaped and sized to allow for gas-assisted direct liquidcooling fluid flow through the first recess.
 2. The assembly of claim 1wherein: the cap member includes an exterior surface that is generallyopposite the first recess surface; and the plurality of channels extendthrough the cap member from the first recess surface to the exteriorsurface of the cap member.
 3. The assembly of claim 2 furthercomprising: cooling liquid located in the first recess.
 4. The assemblyof claim 1 wherein: the first set of rigid small-scale-structure(s) isshaped to define interior spaces that help control circulation of gasand liquid through the first recess to thereby help cool the first chipby gas-assisted direct liquid cooling.
 5. The assembly of claim 4wherein: the first set of rigid small-scale-structure(s) includes astructure having formed therein pores, gaps and/or interstitial spacesless than 100 micrometers in size.
 6. The assembly of claim 1 wherein:the substrate member is at least partially made of silicon.
 7. Theassembly of claim 6 wherein: the first set of rigidsmall-scale-structure(s) is made by etching the cap member in a top downmaterial removal fashion, except in portions underlying remainingportions of a patterned photoresist layer.
 8. The assembly of claim 1further comprising a bonding layer structured, sized, shaped and/orlocated to bond the cap member and the substrate member to each other sothat cooling fluid does not leak from between the cap member and thesubstrate member.
 9. A semiconductor assembly including: a substratemember including a plurality of chips and a top surface; and a capmember with a plurality of recesses formed therein, the cap memberincluding a recess surface corresponding to each recess of the pluralityof recesses and a plurality of sets of rigid small scale structure(s)respectively extending from at least a portion of each recess surfaceinto each recess, with each recess surface and each set of rigid smallscale structure(s) respectively defining a corresponding recess of theplurality of recesses; wherein: each set of rigid small scalestructure(s) includes a structure having formed therein pores, gaps andor interstitial spaces equal to or less than 100 micrometers and is madeby etching the cap member in a top down material removal fashion, exceptin portions underlying remaining portions of a patterned photoresistlayer; each set of rigid small scale structure(s) are sized, shaped andlocated to provide for appropriate fluid flow when gas and liquid arecirculated through the first recess for gas-assisted direct liquidcooling; and the cap member is attached to the top surface of thesubstrate member at a location such that circulation of gas and liquidthrough each recess cools a corresponding chip of the plurality of chipsby gas-assisted direct liquid cooling.
 10. The assembly of claim 9wherein: the cap member includes an exterior surface that is generallyopposite the recess surfaces; and the cap member has formed therein aplurality of pluralities of channels, with each plurality of channelsextending through the cap member from a respectively correspondingrecess surface to the exterior surface of the cap member.
 11. Theassembly of claim 10 wherein: each channel of each plurality of channelshas a sufficiently large transverse cross-section allowing communicationof fluid in gas-assisted direct liquid cooling of the first chip. 12.The assembly of claim 9 wherein: the first set of rigidsmall-scale-structure(s) is shaped to define interior spacessufficiently small such that circulation of gas and liquid through thefirst recess cools the first chip by gas-assisted direct liquid cooling.13. The assembly of claim 9 wherein: each set of rigidsmall-scale-structure(s) includes a structure having formed thereinpores, gaps and/or interstitial spaces less than 100 nanometers in size.14. The assembly of claim 9 wherein: the substrate member is made ofsilicon.
 15. The assembly of claim 14 wherein: the cap member is made ofsilicon; and each set of rigid small-scale-structure(s) is made ofsilicon.